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WIP functionality

From: Berto <berto_lozano_at_yahoo.com>
Date: 27 Dec 2005 21:06:13 -0800
Message-ID: <1135746373.360835.151800@g47g2000cwa.googlegroups.com>


This is a serious geek question, I know, but I need some help. I'm getting different answers from vendors we are speaking to.

As it relates to Oracle's WIP module in Manufacturing, can you split a lot and still retain genealogy? Can this be done in native WIP or do we have to look at the advanced Shop Floor module?

Some detail if it helps: We receive 50 raw wafers from a vendor and record the vendor's lot number. We send wafers into our line with a mother lot number and a reference to the vendor's lot number. A lot of 25 wafers moves through the first steps of the production line; at a point in the processing, the lot is split into 25 separate lots. The mother lot number is associated with each split. The 25 lots are tracked through additional steps as one wafer. Currently, we can associate every finished product with a mother lot and each mother lot with an outside process vendor lot number. It is possible for a single wafer to be split into 560 different lots (though it has never happened that way.)

Any insight - even second info - is most appreciated. Received on Tue Dec 27 2005 - 23:06:13 CST

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